Preview

User

Not a user? Register with this site Forgot your password?

Russian Technological Journal

Advanced search
Fullscreen

For citations:

Nazarenko M.V. Comparison of magnetron sputtering systems for high-rate deposition of thick copper layers for microelectronic applications. Russian Technological Journal. 2022;10(5):92-99. https://doi.org/10.32362/2500-316X-2022-10-5-92-99

Views PDF (Rus): 327
Views PDF (Eng): 178


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.


ISSN 2782-3210 (Print)
ISSN 2500-316X (Online)

86, R-108, Vernadskogo pr., Moscow, 119571, Russian Federation
MIREA - Russian Technological University (RTU MIREA), M.V. Lomonosov Institute of Fine Chemical Technologies
Managing Editor: Galina D. Seredina
+7 499 600-80-80 (#31288)
e-mail: seredina@mirea.ru

Processing of personal data
supported by NEICON (Elpub lab)