LPKF-LDS technology for the production of three-dimensional schemes on plastics
https://doi.org/10.32362/2500-316X-2021-9-1-48-57
Abstract
A promising technology for the production of three-dimensional circuits on plastics, the scope of its current application and prospects for its further development in the radio-electronic industry are considered. The analysis of current opportunities and limitations is carried out. It is shown that the key component of the technology is the correct choice of thermoplastics with suitable characteristics for the intended object, taking into account the resistance to external factors. An analysis of the international and domestic regulatory framework for thermoplastics was conducted. This allowed to determine the key characteristics for 3D-MID-technology and to make a comparison. A classification is proposed on the basis of the key characteristics of thermoplastics for making a decision when choosing materials on the market, taking into account the application in the radio-electronic industry using 3D-MID technology, which is currently either absent or not fully represented. Methods of testing materials for use in the production technology of three-dimensional circuits on plastics and ensuring the quality of manufacturing of radio engineering products, allowing to confirm the compliance of key parameters of materials are studied. The article considers the order of the build process with the application of the LPKF-LDS technology production of three-dimensional circuits on plastics, which allows building a sequence of processes with particular implementation as an example. The considered LPKF-LDS technology as part of the 3D-MID line is planned in the new laboratory “Threedimensional circuits on plastics and flexible media” at the Department of Design and Production of Radioelectronic Devices of the Institute of Radio Engineering and Telecommunications Systems of MIREA – Russian Technological University.
About the Authors
V. S. Ivanov
MIREA – Russian Technological University
Russian Federation
Russian Federation
Vyacheslav S. Ivanov, Assistant, Department of Design and Production of Radio-Electronic Means, Institute of Radio Engineering and Telecommunication Systems
78, Vernadskogo pr., Moscow, 119454
D. A. Gladky
MIREA – Russian Technological University
Russian Federation
Russian Federation
Dmitry A. Gladky, Assistant, Department of Design and Production of Radio-Electronic Means, Institute of Radio Engineering and Telecommunication Systems
78, Vernadskogo pr., Moscow, 119454
D. S. Vorunichev
MIREA – Russian Technological University
Russian Federation
Russian Federation
Dmitry S. Vorunichev, Senior Lecturer, Department of Design and Production of Radio-Electronic Means, Institute of Radio Engineering and Telecommunication Systems
78, Vernadskogo pr., Moscow, 119454
References
1. Franke Y. 3D-MID. Materialy, tekhnologii, svoistva: per. s angl. yaz.; pod red. I.A. Volkova (3D-MID. Materials, technologies, properties: trans. from Engl.; (Ed.) I.A. Volkov. Sankt Peterburg: Professiya; 2014. 336 р. (in Russ.). ISBN: 978-5-91884-062-7
2. Volkov I.A. 3D-MID Technology. New Products Prototyping Capabilities. Elektronika: nauka, tekhnologiya, biznes = Electronics: Science, Technology, Business. 2013;3(125):170–175 (in Russ.).
3. Franke J. 3D-MID Today and Tomorrow. Elektronika: nauka, tekhnologiya, biznes = Electronics: Science, Technology, Business. 2014;7:125–129 (in Russ.).
4. Simidotskii A.E., Litsin K.V. 3D MID technology of threedimensional circuits on plastics. Nauka i proizvodstvo Urala = Science and Production of the Urals. 2016;12:52–54 (in Russ.).
5. Sheikin M. The First Russian 3D-MID Conference. Main Topics Review. Elektronika: nauka, tekhnologiya, biznes = Electronics: Science, Technology, Business. 2013;8:138–147 (in Russ.).
6. Ostec Corporate Group. URL: https://ostec-group.ru/
7. Xu Y., Wu X., Guo X., Kong B., Zhang M., Qian X., Mi S., Sun W. The Boom in 3D-Printed Sensor Technology. Sensors. 2017;17(5):1166. https://doi.org/10.3390/s17051166
8. Hirt E., Ruzicka K. 3D-MID for Space. In: 2018 7th Electronic System-Integration Technology Conference (ESTC). 2018. https://doi.org/10.1109/ESTC.2018.8546449
9. LPKF LDS: Laser Direct Structuring for 3D Moulded Interconnect Devices, Feb 2019. URL: https://www.lpkf.com/en/industries-technologies/electronicsmanufacturing/3D-MIDs-with-laser-direct-structuring-lds/
10. Kamotesov S., Lombard P., Sernet V., Allard B. et al. Omnidirectional inductive wire-less charging of a 3D receiver cube inside a box. In: Proc. 2018 IEEE Wireless Power Transfer Conference (WPTC). 2018. https://doi.org/10.1109/WPT.2018.8639240
Supplementary files
|
|
1. 3D-MID-products | |
| Subject | ||
| Type | Исследовательские инструменты | |
View
(46KB)
|
Indexing metadata ▾ | |
A promising technology for the production of three-dimensional circuits on plastics, the scope of its current application and prospects for its further development in the radio-electronic industry are considered. A classification is proposed on the basis of the key characteristics of thermoplastics for making a decision when choosing materials on the market, taking into account the application in the radio-electronic industry using 3D-MID technology. The article considers the order of the build process with the application of the LPKF-LDS technology production of three-dimensional circuits on plastics.
Review
For citations:
Ivanov V.S., Gladky D.A., Vorunichev D.S. LPKF-LDS technology for the production of three-dimensional schemes on plastics. Russian Technological Journal. 2021;9(1):48-57. (In Russ.) https://doi.org/10.32362/2500-316X-2021-9-1-48-57
Views:
862
Email this article 